Home > Multilayer PCB >

2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression

Product Categories

Multilayer PCB [111]
Fr4 PCB [109]
High Frequency PCB [132]
Rogers PCB [207]
Taconic PCB [43]
RF PCB [35]
Aluminum PCB [40]
Flexible PCB [29]
Rigid Flex PCB [72]
HDI PCB [36]
Heavy Copper PCB [33]
PCB Assembly [48]
Express PCBs [37]
PCB Prototype Board [39]

Shenzhen Xinchenger Electronic Co.,Ltd

Contact Now

2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Min line space : 0.2mm

Min line width : 0.2mm

Copper thickness : 2OZ

Size : 8*6cm

Board THK : 1.2MM

Panel : 1

Surface finish : ENIG+Gold plated

Color : green

Material : FR4 High TG

Model : XCEM

Contact Now

2+6+2 Stack Up Impedance HDI Multilayer PCB FR4 With Rogers Mixed Compression

Specification:

Type: 2+6+2 Stack up Impedance HDI
Material:
Layer Count: 10
Finish Thickness: 1.2+8%mm
Min. Via dia: 0.2mm
Surface Finish: ENIG+Hard Gold Plating
Specialty:
L1-2, L2-3, L8-9, L9-10: Resin fill, laser blind via of 0.1mm; L3-8: Buried via and resin filled.

Parameter:

PCB parameter
Max panel size			508*610mm
Board thickness tolerance			T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness			＞0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)
NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			＞1012Ωnormal
Through-hole resistance			＜300Ωnormal
Electric strength			＞1.3kv/mm
Current breakdown			10A
Peel strength			1.4N/mm
Soldmask regidity			＞6H
Thermal stress			288℃20Sec
Testing voltage			50-300v
Min buried blind via			0.2mm(8mil)
Outer cooper thickness			1oz-5oz
Inner cooper thickness			1/2 oz-4oz
Aspect ratio			8:1
SMT min green oil width			0.08mm
Min green oil open window			0.05mm
Insulation layer thickness			0.075mm-5mm
Aperture			0.2mm-0.6mm
Special technology			Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish			HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Product Tags:

multi layered pcb

multilayer pcb fabrication

2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen Xinchenger Electronic Co.,Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!