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High Frequency TP-2 RF PCB Design Radio Frequency Printed Circuit Board Manufacturing

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Shenzhen Xinchenger Electronic Co.,Ltd

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High Frequency TP-2 RF PCB Design Radio Frequency Printed Circuit Board Manufacturing

Brand Name : XCE

Model Number : XCEH

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : TP-2

Layer : 2

Color : gray

Min line space : 5mil

Min line width : 5mil

Copper thickness : 1OZ

Board size : 3*3cm

Panel : 6*2

DK : 10

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High Frequency PCB RF Design Radio Frequency Circuit Boards Fabrication

Specification:

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.

Parameter:

o	Item	Data
1	Layer:	1 to 24 layers
2	Material type:	FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3	Board thickness:	0.20mm to 3.4mm
4	Copper thickness:	0.5 OZ to 4 OZ
5	Copper thickness in hole:	>25.0 um (>1mil)
6	Max. Board Size:	(580mm×1200mm)
7	Min. Drilled Hole Size:	4mil(0.1mm)
8	Min. Line Width:	3mil (0.075mm)
9	Min. Line Spacing:	3mil (0.075mm)
10	Surface finishing:	HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11	Solder Mask Color:	Green/Yellow/Black/White/Red/Blue
12	Shape tolerance:	±0.13
13	Hole tolerance:	PTH: ±0.076 NPTH: ±0.05
14	Package:	Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15	Certificate:	UL,SGS,ISO 9001:2008
16	Special requirements:	Buried and blind vias+controlled impedance +BGA
17	Profiling:	Punching, Routing, V-CUT, Beveling

Features

CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
ER = 3.38/3.48 at 10.0 GHz
ER is constant to 40.0 GHz
ED (electro-deposited) copper only
Layer-to-layer thickness control = +/- 0.001
Fabrication costs are typical to slightly increased

Product Tags:

Quick Turn Pcb Fabrication

lead free pcb

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